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Wafer Double-Sided Surface Grinder DXSG320

Model DXSG320 / JTEKT Corporation (Official website) / Listed on page 1 of the document

A fully automated 300 mm wafer double-disc surface grinder that integrates double-sided lapping and single-sided grinding in one machine.

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Wafer Double-Sided Surface Grinder DXSG320 on page 1 of JTEKT Corporation "半導体製造工程内で活用できる製品シリーズ ①②"
Source: JTEKT Corporation「半導体製造工程内で活用できる製品シリーズ ①②」page 1
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Specifications

Compatible Wafer Diameter 300 mm

Features

  • Traceability
  • Cleanroom Compatible
  • Fully Automatic Grinding

Applications

  • Wafer Grinding

FAQ

Q. What wafer size and diameter does the DXSG320 support?
A. The supported wafer diameter is 300 mm.
Q. What processes can the DXSG320 perform in one machine?
A. It is a double-disc surface grinder that fully automates double-sided lapping and single-sided grinding in one machine.
Q. What are the features of the DXSG320?
A. Its features are traceability, cleanroom compatibility, and fully automatic grinding.

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